Civinskaya

The authors consider the main method of creating thermally isolated structures of sensors of physical quantities made according to MEMS technologies, that is electrostatic anodic bonding. It was shown that the main reason for a small percentage of production of suitable thermally isolated structures manufactured by a method of electrostatic anodic bonding is unevenness of physical and chemical properties across the whole surface of semi-conductor and corresponding glass plates. The authors propose improvement of the anodic bonding method; designs for adaptations were developed for implementing this improvement. The proposed designs were manufactured and probed. Results confirming the possibility of increase in percentage of production of suitable thermally isolated structures of sensors of physical quantities with the use of the method of electrostatic anodic bonding were obtained.

 Approaches to the problem of temperature compensation of measuring errors of the channel in pressure sensor for spacecraft operating under severe conditions were considered. It was shown that, for correction and, consequently, for temperature compensation of the pressure sensor output two different methods could be used. The first one is ancillary temperature measurements, the second one is ancillary measurements of reference signals. Technical solutions for creating  thermally isolated cells and electronic circuit for temperature compensation of sensors error were developed and tested. Methods of temperature compensation of zero drift and sensitivity of piezoresistive semiconductor pressure sensors were defined. Values of the temperature error were obtained; they allowed us to put manufactured measurement channel according to GOST 22250-93 into class 0.25 accuracy.